In the glass protective film, the adhesive-coated film is called the "substrate" or "backing". The substrate plays an important role in achieving the required functions in the tape and enhancing its strength. Therefore, there are many different types and substrate design technologies that play an important role in the overall development of glass protective films.
In packaging applications, hand-tear performance is a priority. At this time, adhesives should be used with paper substrates. In electrical applications, where insulation and transparency need to be emphasized, polyester film should be used. When high heat resistance is required, such as the use of polyimide in welding shielding, when both wear resistance and smoothness are required, polytetrafluoroethylene film should be used.
In surface protection films that require flexibility as the main performance, polyolefin films should be used. The metal foil is conductive and suitable for connecting various objects, while the foam is used to seal the mobile phone. A polyolefin film with an undulating surface is a good example of a substrate that is not only strong, but also can be tear off by hand, which is suitable for construction applications.
Ichikawa Film, a manufacturer of PET protective film on the surface of deep-drawing molding of items such as sinks, is an example of substrate design, which makes full use of the characteristics of the substrate. Dicing tape for silicon wafers is an example of substrate design, in which case the stretch properties of plastic films are utilized. After dicing, although the dicing tape used to fix the chip during picking is stretched, it is still within the pressure that the design can withstand.