First, in the production process, a stainless steel protective film was applied to the quality of the base material. The quality of the substrate directly affects its performance. In other words, we must first guarantee the quality of the substrate to ensure the final quality of the product. Second, the residual adhesion rate is actually the force experienced by the paper after the first peel and the second peel. The calculated data mainly reflects the curing effect of silicone oil. The next step is to determine the peel strength of the protective film. Generally, the peeling force directly affects the performance of the stainless steel protective film. The tolerance range of peel force in general industry standards is (+15%). In addition, it has a certain relationship with the processing environment of the product. With the development of various products and the improvement of quality technology, the requirements for the cleanliness of the protective film are becoming more and more stringent, especially in the electronic film cutting industry. So, in practical applications, what benefits can stainless steel protective film bring? First of all, using the product helps reduce the possibility of collisions. The whole process of stainless steel parts is as follows: the whole sheet of metal sheet film is transported, CNC blanking, transportation, forming, transportation, stamping, transportation, cleaning, tearing film transportation, inspection and unloading. After using the protective film, it can greatly reduce the occurrence of parts bumps. In short, the use of stainless steel protective film provides good measures for surface protection and quality assurance of stainless steel products. The stainless steel protective film improves the surface quality, production efficiency, production cycle and input-output rate of parts. In addition, with the popularity of protective films, the probability of scrapping of parts is reduced, the amount of cleaning agents and lubricants is reduced, and maintenance costs are reduced.